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C-flat Holey Carbon Grids for TEM – Copper Only
C-flat™ is an ultra-flat, holey carbon-coated TEM support grid for transmission electron microscopy (TEM). Unlike competing holey carbon films, C-flat™ is manufactured without plastics, so it is clean upon arrival and the user has no residue to contend with.
Full Description
Product Information
- Advantages
- Applications
- Cryo-electron tomography (cryoET) and Single Particle Analysis (SPA)
- Automated TEM
C-flat™ leads to better data sets. Made with patent pending technology, C-flat™ provides an ultra-flat surface that results in better particle dispersion and more uniform ice thickness. Patterning is done using deep-UV projection lithography, ensuring the most accurate and consistent hole shapes and sizes down to submicron features. The precise methods by which C-flat™ is manufactured elminate artifacts such as excess carbon and edges around holes.
| NAME | SKU | HOLE SIZE | HOLE SPACING | TEM MESH | TEM GRID |
|---|---|---|---|---|---|
| CF-1.2/1.3-2C (100/pk) | M-CF213-100 | 1.2 µm | 1.3 µm | 200 | Cu |
| CF-1.2/1.3-3C (100/pk) | M-CF313-100 | 1.2 µm | 1.3 µm | 300 | Cu |
| CF-1.2/1.3-4C (100/pk) | M-CF413-100 | 1.2 µm | 1.3 µm | 400 | Cu |
| CF-2/0.5-2C (100/pk) | M-CF205-100 | 2 µm | 0.5 µm | 200 | Cu |
| CF-2/0.5-3C (100/pk) | M-CF305-100 | 2 µm | 0.5 µm | 300 | Cu |
| CF-2/0.5-4C (100/pk) | M-CF405-100 | 2 µm | 0.5 µm | 400 | Cu |
| CF-2/1-2C (S100/pk) | M-CF212-100 | 2 µm | 1 µm | 200 | Cu |
| CF-2/1-3C (100/pk) | M-CF312-100 | 2 µm | 1 µm | 300 | Cu |
| CF-2/1-4C (100/pk) | M-CF412-100 | 2 µm | 1 µm | 400 | Cu |
| CF-2/2-2C (100/pk) | M-CF-222C-100 | 2 µm | 2 µm | 200 | Cu |
| CF-2/2-3C (100/pk) | M-CF-223C-100 | 2 µm | 2 µm | 300 | Cu |
| CF-2/2-4C (100/pk) | M-CF-224C-100 | 2 µm | 2 µm | 400 | Cu |
| CF-2/4-2C (100/pk) | M-CF242-100 | 2 µm | 4 µm | 200 | Cu |
| CF-2/4-3C (100/pk) | M-CF342-100 | 2 µm | 4 µm | 300 | Cu |
| CF-2/4-4C (100/pk) | M-CF442-100 | 2 µm | 4 µm | 400 | Cu |
| CF-4/1-2C (100/pk) | M-CF241-100 | 4 µm | 1 µm | 200 | Cu |
| CF-4/1-3C (100/pk) | M-CF341-100 | 4 µm | 1 µm | 300 | Cu |
| CF-4/2-2C (100/pk) | M-CF422-100 | 4 µm | 2 µm | 200 | Cu |
| CF-4/2-3C (100/pk) | M-CF423-100 | 4 µm | 2 µm | 300 | Cu |
| CF-4/2-4C (100/pk) | M-CF424-100 | 4 µm | 2 µm | 400 | Cu |
| CF-MH-2C (100/pk) | M-CF2MH-100 | Multi* | Multi* | 200 | Cu |
| CF-MH-3C (100/pk) | M-CF3MH-100 | Multi* | Multi* | 300 | Cu |
| CF-MH-4C (100/pk) | M-CF4MH-100 | Multi* | Multi* | 400 | Cu |
| CF-1/1-2C (100/pk) | M-CF21-100 | 1 µm | 1 µm | 200 | Cu |
| CF-1/1-3C (100/pk) | M-CF31-100 | 1 µm | 1 µm | 300 | Cu |
| CF-1/1-4C (100/pk) | M-CF41-100 | 1 µm | 1 µm | 400 | Cu |
* The Multihole device has a staggered pattern of six features consiting of three circle patterns of 1 micron, 1.4 micron and 2 micron diameter and three ellipse patterns of 1×4 microns, 1.4×5.6 microns and 2×8 microns.